Cooperation
Projects and contracts
IST PROJECTS
Project: SHAPES
Partners: ADR/TIMA, Eidgenoessische Technische Hochschule (Switzerland), Rheinisch-westfaelische Technische Hoschule (Germany), Istituto Nazionale di Fisica Nucleare (Italia), Target Compiler Technologies (Belgium), St Microelectronics SA (France), Univesita di Pisa (Italia), Universita Degli Studi di Cagliari (Italia), Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung (Germany), Medcom Gesellschaft fuer Medizinische Bilvererbeitung (Germany), PIE Medical Equipement BC (Neederlands), THALES Communication (France)
Title: Scalable software Hardware Architectures Platform for Embedded Systems
IST PROJECTS
Project: SPRINT
Partners: ADR/TIMA,France; FROSILOG SA, France; Universitaet Pederborn, Germany; KEESDA, France; Philips Semicondductors BV, The Netherlands; KUNGLIA TEKNISKA HOEGSKOLAN, Sweden; SPIRATECH Ltd, France; EUROPEAN ELECTRONIC CHIPS & SYSTEMS DESIGN INITIATIVE, France; ARM Ltd, United Kingdom; LAUTERBACH DATENTECHNIK; Germany.
Title: Open SoC Design Platform for Reuse and Integration of IPs
IST PROJECTS
Project: VIBES
Partners: Philips Electronics Nederland BV, Netherlands, Philips Inovative Technology Solutions NV, Belgium, ADR, France, University of Southampon, United Kingtom, University of Cork, Irlande,CNRS, France, MEMSCAP, France, METRAVIB, France, Philips GmbH, Germany
Title: Vibration Energy Scavenging
LATIN AMERICA HIGHER EDUCATION, ALFA
Project: NICRON
Partners: Universidade Federal do Rio Grande do Sul (UFRGS), Brazil; Instituto Nacional de Tecnologia Industrial (INTI), Argentine; Universidad del Valle (UV), Colombia; Pontificia Universitad Catolica de Peru (PUCP), Peru, Universitad de la Republica (UR), Uruguay; Instituto Nacional de Astrofisica, Optica y Electronica (INAOE), Mexico; Politecnico di Torino (POLITO), Italy; Instituto Superior Tecnico (IST), Portugal; Ecole Nationale Supérieure d'Electronique, Informatique et Radiocommunications (ENSEIRB), Bordeaux, France; IMSE-CNM (Instituto de Microelectronica de Sevilla), Spain; Institut National Polytechnique de Grenoble (INPG/TIMA), France.
Title: Fault-Tolerant System Design and Verification for Safety Critical Applications Built from Afvanced Integrated Circuits
MEDEA PROJECTS, MEDEA+
Project: Beyond DREAMS
Partners: STMicroelectronics (Grenoble) SAS, MAGILLEM Design Services, CEA/LETI, Université PARIS VI PIERRE et MARIE-CURIE.
Title: Beyond DREAMS
MEDEA PROJECTS, MEDEA+
Project: 2A714 : SOFTSOC
Partners: THALES Communications SA, THOMSON R&D France, CEA/LETI
Title: SOFTSOC
MEDEA PROJECTS, MEDEA+
Project: iGLANCE
Partners: STMicroélectronics(Grenoble) SAS, 4D WIEW Solution, LOGICA IT SERVICES France, INRIA
Title: interactive Genius Look At Numerous Contemporary Events
MEDEA PROJECTS, MEDEA+
Project: 2A 703: NEVA
Partners: MINIFI/DGE/STSI, BULL, CERTESS, CEA-LETI, SILICOMP, STMicroelectronics, UJF/VERIMAG, TIMA/INPG
Title: Networks on Chips Design Driven by Video and Distribued Appplications
MEDEA PROJECTS, MEDEA+
Project: 2A702 : NANO TEST
Partners: MINEFI/DGE/STSI, PHILIPS France, STMicroelectronics SA, INFINEON Technologies France, TEMENTO Systems, CEA/LETI-DCIS, CNRS DR 13/LIRMM, TIMA/INPG
Title: NanoTEST
